Services Electronic Device Failures

As the miniaturization of electronic components progresses, so do the challenges in making the devices reliable and accurate. Under such conditions it becomes extremely important to find whether the electronic device failure is limited to an isolated piece under investigation (because of unusual service conditions or an inherent weakness) or if the problem is more systemic and requires re-design/ manufacturing considerations . An electronic device failure could be because of localized environment like dust, humidity, chemicals, and vibrations. It could also be due to design and/ or manufacturing aspects such as from deficient selection of encapsulating material, overstressing (thermal or electrical), cracking of bond wires, inter-metallic diffusion, insulation failure, etc. AEIS can reliably investigate the cause of electronic device failures using state-of-art equipment such as optical, infrared and scanning electron microscopes, Energy Dispersive Spectroscopy, micro-probing Thermal Imaging, and Non Destructive Testing.

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